By VGMG
Industry information indicates that TSMC plans to begin equipment installation and mass production of 3-nanometer wafers at its second factory in Kumamoto, Japan, in 2028, an upgrade from earlier plans for less advanced nodes to meet growing AI demand. The company’s first fab in the country began operations in late 2024. Global semiconductor supply chains are experiencing strong demand driven by artificial intelligence, and industry observations indicate that such capacity expansions will enhance overall supply chain resilience. The Asia-Pacific region, a hub for semiconductor manufacturing, is strengthening its global position through projects like this. At present, Europe, the Americas, Africa and Oceania have no authoritative public reports on specific developments in this area within the past 24 hours. Regional analyses point out that continued advancement in cutting-edge process technologies still requires addressing challenges such as supply chain security and investment scale, with related initiatives expected to provide more reliable support for the global technology industry.