Foxconn and Intel announce AI infrastructure partnership at Computex 2026
TAIPEI — Foxconn and Intel announced a strategic partnership at Computex 2026 in Taipei to jointly develop next-generation AI infrastructure and intelligent computing platforms.
The collaboration combines Intel’s processor architecture and chip technologies with Foxconn’s manufacturing scale and system integration capabilities. SambaNova Systems is also participating in a rack-scale AI infrastructure project built on Intel Xeon processors as part of the agreement.
According to the companies, the partnership aims to address key bottlenecks in data center operations, including high-speed interconnect technologies, system telemetry, and advanced cooling solutions.
The scope of the collaboration extends to edge AI and physical AI applications, such as robotics, automotive systems, smart city infrastructure, and industrial computing.
Foxconn Chairman and CEO Young Liu said the partnership will leverage the strengths of both companies across computing platforms, system integration, and global supply chain capabilities.
The announcement comes amid rising global demand for AI infrastructure, with technology companies and governments increasing their investments in computing capacity.